| 制造商 | 部件名 | 数据表 | 功能描述 |
 Taiyo Yuden (U.S.A.), I... |
RVR-50V2R2MD55U-R2
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251Kb/2P
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VERTICAL CHIP TYPE ALUMINUM ELECTROLYTIC CAPACITORS[RVR]
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RVR-50V2R2MD55U-R2
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372Kb/2P
|
VERTICAL CHIP TYPE ALUMINUM ELECTROLYTIC CAPACITORS[VVR]
|
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RVR-50VR22MD55U-R2
|
251Kb/2P
|
VERTICAL CHIP TYPE ALUMINUM ELECTROLYTIC CAPACITORS[RVR]
|
| Search Partnumber :
Start with "2MD55U-R2" -
Total : 100 ( 1/5 Page) |
 RMT Ltd. |
2MD04-014-05
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-05
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2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-08
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-08
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2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-10
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-10
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2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-12
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-12
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2Mb/8P |
Blank ceramics (not metallized)
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2MD04-014-15
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-014-15
|
2Mb/8P |
Blank ceramics (not metallized)
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2MD04-022-05
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334Kb/4P |
Thermoelectric Module
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2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized)
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2MD04-022-05-1
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
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2MD04-022-05/1
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2Mb/8P |
Blank ceramics (not metallized)
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2MD04-022-05
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2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
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2MD04-022-08
|
334Kb/4P |
Thermoelectric Module
|