| 制造商 | 部件名 | 数据表 | 功能描述 |
 Sony Corporation |
-376-464-11
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
 Molex Electronics Ltd. |
0015911464-ND
|
1Mb/8P
|
2.54mm (.100) Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
|
 ITT Industries |
045464-0010
|
36Kb/1P
|
Brand: Cannon Product Category: Circular Product Line: MIL-DTL 26482 Series I & Mil Battery Series: KPT / SE
|
 HARTING Technology Grou... |
09-03-464-2824
|
731Kb/4P
|
DIN-Signal C064FS-2,9C1-1-clip
|
|
09-03-464-2825
|
731Kb/4P
|
DIN-Signal C064FS-4,5C1-1-clip
|
|
09-03-464-6825
|
731Kb/4P
|
DIN-Signal C064FS-4,5C1-2-clip
|
|
09-03-464-7824
|
731Kb/4P
|
DIN-Signal C064FS-2,9C1-3-clip
|
|
09-03-464-7825
|
731Kb/4P
|
DIN-Signal C064FS-4,5C1-3-clip
|
 Tyco Electronics |
1-146464-0
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-1
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-2
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-3
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-4
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-5
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-6
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-7
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-8
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-146464-9
|
239Kb/1P
|
HEADER ASSEMBLY, MOD II, STACKING, SINGLE ROW, 025 SQ POST, UNSHROUDED
|
|
1-215464-0
|
3Mb/100P
|
Ribbon Cable Connector Selection Guide
|
|
1-215464-0
|
4Mb/18P
|
AMP Micro-Match Miniature Connector System
|