| 制造商 | 部件名 | 数据表 | 功能描述 |
 Sony Corporation |
6-500-335-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-500-522-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-501-571-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-501-654-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-501-656-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-501-734-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-501-743-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-501-747-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-501-782-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
|
6-502-131-01
|
3Mb/38P
|
SERVICE MANUAL
Ver. 1.0 2007. 08
|
 Tyco Electronics |
6-50462-7
|
87Kb/1P
|
MINIATURE SPRING SOCKET ASSEMBLY, SERIES 2
|
 TE Connectivity Ltd |
6-510500-5
|
818Kb/3P
|
THIS DRAWING IS A CONTROLLED DOCUMENT.
|
|
6-510500-5
|
738Kb/3P
|
THIS DRAWING IS A CONTROLLED DOCUMENT.
|
 Tyco Electronics |
6-5177986-1
|
400Kb/13P
|
Stacking Height Guide for Parallel Board-to-Board Applications
|
|
6-5177986-1
|
418Kb/13P
|
Stacking Height Guide for Parallel Board-to-Board Applications
|
|
6-5177986-1
|
769Kb/13P
|
Stacking Height Guide for Parallel Board-to-Board Applications
|
|
6-5177986-2
|
400Kb/13P
|
Stacking Height Guide for Parallel Board-to-Board Applications
|
|
6-5177986-2
|
418Kb/13P
|
Stacking Height Guide for Parallel Board-to-Board Applications
|
|
6-5177986-2
|
769Kb/13P
|
Stacking Height Guide for Parallel Board-to-Board Applications
|
|
6-5177986-3
|
418Kb/13P
|
Stacking Height Guide for Parallel Board-to-Board Applications
|