| 制造商 | 部件名 | 数据表 | 功能描述 |
 Samsung semiconductor |
CIM03J121
|
1Mb/16P
|
Chip Bead ; CIB/CIM Series For EMI Suppression
|
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03J121
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03J121
|
1Mb/16P
|
Chip Bead CIB/CIM Series
|
|
CIM03J241
|
1Mb/16P
|
Chip Bead ; CIB/CIM Series For EMI Suppression
|
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03J241
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03J241
|
1Mb/16P
|
Chip Bead CIB/CIM Series
|
|
CIM03J471
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
|
CIM03J601
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
|
CIM03N300
|
1Mb/16P
|
Chip Bead ; CIB/CIM Series For EMI Suppression
|
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03N300
|
4Mb/31P
|
MULTILAYER CHIP COMPONENTS
|
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series For EMI Suppression
|
|
CIM03N300
|
1Mb/16P
|
Chip Bead CIB/CIM Series
|