| 制造商 | 部件名 | 数据表 | 功能描述 |
 RMT Ltd. |
1MC10-029-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-029-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MC10-029-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-029-10
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MC10-029-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-029-15
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MC10-029-20
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-029-20
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MC10-031-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-031-10
|
260Kb/3P |
Thermoelectric Module
|
|
1MC10-031-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-031-15
|
260Kb/3P |
Thermoelectric Module
|
|
1MC10-031-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-031-20
|
260Kb/3P |
Thermoelectric Module
|
|
1MC10-031-20
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-039-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-039-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MC10-039-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MC10-039-10
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MC10-039-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|