| 制造商 | 部件名 | 数据表 | 功能描述 |
RMT Ltd. |
1ML06-017
|
838Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05
|
392Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1ML06-017-05AN
|
386Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05AN05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05AN25
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05T
|
390Kb/4P |
Thermoelectric Module
|
|
1ML06-017-05T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07
|
392Kb/4P |
Thermoelectric Module
|
|
1ML06-017-07
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1ML06-017-07AN
|
386Kb/4P |
Thermoelectric Module
|
|
1ML06-017-07AN05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07AN25
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-07T
|
390Kb/4P |
Thermoelectric Module
|
|
1ML06-017-07T
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1ML06-017-09
|
392Kb/4P |
Thermoelectric Module
|
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