| 制造商 | 部件名 | 数据表 | 功能描述 |
 RMT Ltd. |
1MX06-063-05
|
388Kb/4P |
Thermoelectric module
|
|
1MX06-063-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-05
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MX06-063-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-08
|
388Kb/4P |
Thermoelectric module
|
|
1MX06-063-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MX06-063-10
|
388Kb/4P |
Thermoelectric module
|
|
1MX06-063-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-10
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MX06-063-12
|
388Kb/4P |
Thermoelectric module
|
|
1MX06-063-12
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-12
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
1MX06-063-12
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
1MX06-063-15
|
388Kb/4P |
Thermoelectric module
|
|
1MX06-063-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|