| 制造商 | 部件名 | 数据表 | 功能描述 |
 RMT Ltd. |
2MD04-014-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-014-05
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-014-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-014-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-014-10
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-014-10
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-014-12
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-014-12
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-014-15
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-014-15
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-022-05
|
334Kb/4P |
Thermoelectric Module
|
|
2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-022-05-1
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-022-05/1
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-022-05
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-022-08
|
334Kb/4P |
Thermoelectric Module
|
|
2MD04-022-08
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|
|
2MD04-022-08
|
2Mb/8P |
Blank ceramics (not metallized)
|
|
2MD04-022-08-1
|
2Mb/8P |
Blank ceramics (not metallized) Metallized (Au plating) Blank, tinned Copper
|