| 制造商 | 部件名 | 数据表 | 功能描述 |
WeEn Semiconductors |
WNB111C5APTS
|
948Kb/7P |
Hyperfast power diode - Bare die
|
|
WNB111V5APTS
|
250Kb/7P |
Ultrafast power diode - Bare die
|
Ohmite Mfg. Co. |
WNB100FE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB100FE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
|
WNB10RFE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB10RFE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
WeEn Semiconductors |
WNB138C5APPS12
|
251Kb/7P |
Hyperfast power diode - Bare die
|
Ohmite Mfg. Co. |
WNB150FE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB150FE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
|
WNB15RFE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB15RFE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
WeEn Semiconductors |
WNB160V5SPTS
|
2Mb/7P |
Ultrafast power diode - Bare die
|
|
WNB169C5APPS12
|
251Kb/7P |
Hyperfast power diode - Bare die
|
|
WNB199V5APTS
|
306Kb/7P |
Ultrafast power diode - Bare die
|
|
WNB199V5APTSV
|
306Kb/7P |
Ultrafast power diode - Bare die
|
Ohmite Mfg. Co. |
WNB1K0FE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB1K0FE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
|
WNB1R0FE
|
119Kb/1P |
Miniature Molded Wirewound
|
|
WNB1R0FE
|
305Kb/2P |
Encapsulated by epoxy molding compound
|
WeEn Semiconductors |
WNB051C5APTS
|
2Mb/7P |
Hyperfast power diode - Bare die
|
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