Features
• AEC-Q100 qualified Grade 2
Core and Infrastructure
• Dual ARM CortexA7 up to 600 MHz, withMMU, FPU and NEON support
• Memory organization:
– L1 Cache: 32 KB I, 32 KB D
– L2 Cache: 256 KB
– Total embedded SRAM: 768 KB
Embedded Vehicle Interface
• Isolated Cortex-M3 core
– L1 Cache: 8 KB I
• 256 KB reserved embedded SRAM (extendible to 768 KB)
• 1x CAN Standard (C_CAN)
• 2x CAN FD (M_CAN)
• 1x Flexray
Media Interfaces
• 1x SD/MMC/SDIO SDR50 (SD/MMC0)
• 1x SD/MMC/SDIO SDR25 (SD/MMC1)
• 1x USB 2.0 DR with HS PHY and HSIC
• 1x USB 2.0 DR with HS PHY
• 2x ETH AVB MAC with RMII/RGMII
Embedded HW Security Module
• HIS SHE/SHE+ Service Set with extensions for PKC (SHE_EXT)
• Cryptographic Functions Accelerators
– Symmetric keys: MP AES
– Public keys: RSA, ECC
– Hash: MD5, SHA1, SHA2
• True Random Number Generator
• User pogrammable OTP memory (eHSM OTP)
Memory Interfaces
• 16-bit DDR3L-1066 (533 MHz)
• 16-bit LPDDR2-800 (400 MHz)
• SQI Interface
• 8-bit Parallel NAND (1 chip select)
I/O Interfaces
• 1x 6-channel 10-bits ADC
• 3x I2C multi-master/slave interfaces
• 6x UART controller
• 3xI2S audio interfaces
• 3x Synchronous Serial Port (SSP/SPI)
• 5x 32-bit GPIO ports
• JTAG based in-circuit emulator (ICE) with Embedded Trace Module

Operating conditions
• VDD, VDD_ARM: 1.14 V-1.21 V
• VDD_IO_3V3: 3.3 V ±10%
• VDD_IO_SDMMC0: 1.8 V-3.3 V ±10%
• VDD_IO_BOOT: 1.8 V/3.3 V ±10%
• VDD_IO_ON: 3.3 V ± 10%
• VDDQ: 1.35 V ± 5% (DDR3L)
• Junction temperature range: -40 C/ +150 C

Description
STA1385 is a fully automotive, power efficient System-On-Chip, targeting cost
effective processing solutions for innovative Telematics and Connectivity applications
including Cyber-security protection.
It features a powerful Dual ARM Cortex-A7 processor, an embedded and
independent Hardware Security Module (HSM), an isolated sub-system based on
ARM Cortex-M3 for vehicle CAN interface and a full set of standard connectivity
interfaces, including a dual Gbit ETH AVB controller and Flexray.