LFBGA361

(16x16x1.7, 0.8mm pitch)

GAPGPS00902

Features

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AEC-Q100 qualified Grade 2

Core and Infrastructure

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Dual ARM CortexA7 up to 600 MHz, withMMU, FPU and NEON support

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Memory organization:

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L1 Cache: 32 KB I, 32 KB D

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L2 Cache: 256 KB

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Total embedded SRAM: 768 KB

Embedded Vehicle Interface

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Isolated Cortex-M3 core

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L1 Cache: 8 KB I

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256 KB reserved embedded SRAM (extendible to 768 KB)

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1x CAN Standard (C_CAN)

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2x CAN FD (M_CAN)

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1x Flexray

Media Interfaces

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1x SD/MMC/SDIO SDR50 (SD/MMC0)

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1x SD/MMC/SDIO SDR25 (SD/MMC1)

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1x USB 2.0 DR with HS PHY and HSIC

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1x USB 2.0 DR with HS PHY

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2x ETH AVB MAC with RMII/RGMII

Embedded HW Security Module

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HIS SHE/SHE+ Service Set with extensions for PKC (SHE_EXT)

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Cryptographic Functions Accelerators

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Symmetric keys: MP AES

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Public keys: RSA, ECC

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Hash: MD5, SHA1, SHA2

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True Random Number Generator

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User pogrammable OTP memory (eHSM OTP)

Memory Interfaces

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16-bit DDR3L-1066 (533 MHz)

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16-bit LPDDR2-800 (400 MHz)

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SQI Interface

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8-bit Parallel NAND (1 chip select)

I/O Interfaces

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1x 6-channel 10-bits ADC

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3x I2C multi-master/slave interfaces

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6x UART controller

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3xI2S audio interfaces

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3x Synchronous Serial Port (SSP/SPI)

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5x 32-bit GPIO ports

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JTAG based in-circuit emulator (ICE) with Embedded Trace Module

Product status link

STA1385

Product summary

Order code

STA1385

Package

LFBGA 361

16x16x1.7mm

Packing

Tray/ Tape and reel

Telemaco3P automotive family of telematics and connectivity microprocessor

STA1385

Data brief

DB3423 - Rev 2 - February 2020

For further information contact your local STMicroelectronics sales office.

www.st.com