| 制造商 | 部件名 | 数据表 | 功能描述 |
 STATS ChipPAC, Ltd. |
FBGA
|
559Kb / 2P |
Fine Pitch Ball Grid Array
|
|
FBGA-SD
|
559Kb / 2P |
Fine Pitch Ball Grid Array - Stacked Die
|
|
FLGA-SD
|
537Kb / 2P |
Fine Pitch Land Grid Array - Stacked Die
|
 Amkor Technology |
CLGA
|
357Kb / 1P |
Ceramic Land Grid Array Package
|
 Yamaichi Electronics Co... |
IC264-22501-1
|
200Kb / 1P |
Ball Grid Array (BGA, 1.50mm Pitch)
|
|
NP276-11904
|
738Kb / 11P |
Ball Grid Array (BGA, 1.27mm Pitch)
|
|
NP291-03617
|
41Kb / 1P |
Fine Ball Grid Array (FBGA, 0.75mm Pitch)
|
|
NP352-04808
|
563Kb / 8P |
Fine Ball Grid Array (FBGA, 1.00mm Pitch)
|
|
NP396-500
|
120Kb / 1P |
Shrink Ball Grid Array (1.27mm Pitch)
|
 Abracon Corporation |
ASCSM
|
1Mb / 3P |
Ball Grid Array Packaging
04.24.14 |