www.statschippac.com

FEATURES

• Low profile

• Flexible body sizes range from 4 x 4mm to

13 x 13mm

• Flip chip and discrete passive options (SiP)

• Minimum 0.50mm pitch (array and peripheral land

pads)

• Flexible land pattern arrangement

• Pb-free and halogen-free compatible materials

available

• JEDEC standard compliant

APPLICATIONS

• Handheld devices

• Wireless RF

• Analog

• ASIC

• Memory

• Simple PLDs

• Array molded, cost effective, space-saving

packaging solution

• Available in 1.20mm (TFLGA), 1.00mm

(VFLGA), and 0.80mm (WFLGA) maximum

thickness

• Thinner than FBGA

• Exposed thermal/mechanical lands available

• Laminate substrate based enabling 2 and 4

layers of routing flexibility

DESCRIPTION

STATS ChipPAC’s FLGA is a laminate substrate based package

with plastic overmolded encapsulation. Unlike a standard

FBGA, second level interconnect is achieved on the LGA by

connecting “lands” on the package directly onto the PCB

through solder re-flow. The elimination of solder balls brings

better electrical performance and lower package profile

without using the more expensive thinner BT core material.

It also offers the flexibility of land pattern arrangement in

the form of signal lands or heat spreader/ground pads to

suit the thermal and electrical requirements of various

devices. The FLGA package’s reduced outline and thickness

make it an ideal advanced technology packaging solution

for high performance and/or portable applications. STATS

ChipPAC’s FLGA is available in a broad range of JEDEC

standard body sizes including TFLGA (<1.20mm), VFLGA

(<1.00mm) and WFLGA (<0.80mm) package thickness.

FLGA

Fine Pitch Land Grid Array