| 制造商 | 部件名 | 数据表 | 功能描述 |
 Intersil Corporation |
M24.173B
|
42Kb / 1P |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
|
 fujitsu semiconductor |
FPT-28P-M17
|
36Kb / 1P |
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC
|
|
FPT-8P-M02
|
23Kb / 1P |
SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC
|
 Bourns Electronic Solut... |
SOT-223
|
150Kb / 5P |
4-Pin Plastic Small Outline Surface Mount
|
|
8-SOIC
|
139Kb / 4P |
8-Pin Plastic Small Outline Surface Mount
|
 Advanced Power Electron... |
AP2306AGEN-HF
|
101Kb / 4P |
Small Outline Package
|
|
AP2318AGEN-HF
|
64Kb / 4P |
Small Outline Package
|
|
AP2323AGN-HF
|
104Kb / 4P |
Small Package Outline
|
 Amkor Technology |
SSOP
|
433Kb / 2P |
Shrink Small Outline, Quarter-Size Small-Outline Packages
|
 Guangdong Youtai Semico... |
LM75B
|
312Kb / 23P |
plastic thin shrink small outline package; 8 leads;
|