SSOP 数据表(PDF) - Amkor Technology

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SSOP 数据表 (PDF) - Amkor Technology

SSOP Datasheet PDF - Amkor Technology


部件名	SSOP

下载	SSOP 下载

文件大小	433.21 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Shrink Small Outline, Quarter-Size Small-Outline Packages

SSOP Datasheet (PDF)

Go To PDF Page

下载数据表

SSOP Datasheet PDF - Amkor Technology


部件名	SSOP

下载	SSOP Click to download

文件大小	433.21 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Shrink Small Outline, Quarter-Size Small-Outline Packages

SSOP 数据表 (HTML) - Amkor Technology

SSOP Datasheet HTML 1Page - Amkor Technology

SSOP Datasheet HTML 2Page - Amkor Technology

类似零件编号 - SSOP

制造商	部件名	数据表	功能描述
Amkor Technology	SSOP	780Kb / 3P	ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based 12/21
Amkor Technology	SSOP	411Kb / 2P	Silver Wirebonding 02/22
List of Unclassifed Man...	SSOP-16	88Kb / 1P	16-Lead SSOP Plastic Package
Global Mixed-mode Techn...	SSOP-16	121Kb / 1P	Package Outline
Global Mixed-mode Techn...	SSOP-16(209MILS)	122Kb / 1P	Package Outline

类似说明 - SSOP

制造商	部件名	数据表	功能描述
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
STMicroelectronics	TSSO20	57Kb / 4P	20-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
Intersil Corporation	M24.173B	42Kb / 1P	Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP)
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSSOP	304Kb / 1P	Ceramic Shrink Small Outline Package
STMicroelectronics	TSSOP14	58Kb / 4P	14-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
ACCUTEK MICROCIRCUIT CO...	AK06D300-QSOP	174Kb / 4P	Quarter Size Small Outline Package QSOP DIP Adapters
	AK16D300	79Kb / 3P	Shrink Small Outline Package SSOP DIP Adapters
	AKL083220	128Kb / 2P	Thin Shrink Small Outline Packages TSOP to SOIC Leaded Adapters
List of Unclassifed Man...	IC189-0162-019	444Kb / 7P	SOP (Small Outline Packages, Gullwing Leads)

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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