CSSOP 数据表(PDF) - Amkor Technology

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CSSOP 数据表 (PDF) - Amkor Technology

CSSOP Datasheet PDF - Amkor Technology


部件名	CSSOP

下载	CSSOP 下载

文件大小	304.39 Kbytes

页	1 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Ceramic Shrink Small Outline Package

CSSOP Datasheet (PDF)

Go To PDF Page

下载数据表

CSSOP Datasheet PDF - Amkor Technology


部件名	CSSOP

下载	CSSOP Click to download

文件大小	304.39 Kbytes

页	1 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Ceramic Shrink Small Outline Package

CSSOP 数据表 (HTML) - Amkor Technology

CSSOP Datasheet HTML 1Page - Amkor Technology

类似零件编号 - CSSOP

制造商	部件名	数据表	功能描述
Copal Electronics	CSS	1Mb / 5P	COMPACT SLIDE SWITCHES
Stackpole Electronics, ...	CSS	530Kb / 13P	Ultra-precision Metal Alloy Current Sensing Chip Resistor 7/29/2022
TT Electronics.	CSS	546Kb / 2P	CURRENT SENSE SMT CHIP RESISTOR
CUI INC	CSS-0575A	391Kb / 5P	MAGNETIC BUZZER
CUI INC	CSS-0575A-SMT	305Kb / 3P	MAGNETIC BUZZER TRANSDUCER

类似说明 - CSSOP

制造商	部件名	数据表	功能描述
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
National Semiconductor ...	MTD48	62Kb / 1P	48 Lead Molded Thin Shrink Small Outline Package, JEDEC
STMicroelectronics	TSSO20	57Kb / 4P	20-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSOIC	374Kb / 1P	Ceramic Small Outline Integrated Circuit Package
STMicroelectronics	TSSOP14	58Kb / 4P	14-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
ACCUTEK MICROCIRCUIT CO...	AK16D300	79Kb / 3P	Shrink Small Outline Package SSOP DIP Adapters
Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
Amkor Technology	SSOP	433Kb / 2P	Shrink Small Outline, Quarter-Size Small-Outline Packages
Guangdong Youtai Semico...	LM75B	312Kb / 23P	plastic thin shrink small outline package; 8 leads;

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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