data sheet

CSSOP

Features:

CERAMIC

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Ceramic Shrink Small Outline

Package (CSSOP)

This is a ceramic version of the Plastic SSOP

package. The CSSOP is a hermetic package

consisting of two pieces of dry pressed ceramic

surrounding a "gullwing" formed leadframe. This

package has leads extending from two sides of the

package (dual). The ceramic / LF / ceramic system

is held together hermetically by glass. The frit lid

is sealed/reflowed over the package cavity at

temperatures between 400° - 460° Centigrade.

Applications:

These packages enable end products (pagers,

portable audio / video, disc drives, radio, RF

devices / components, telecom) to be reduced in

size and weight. Semiconductor families such as

operational amplifiers, drivers, optoelectronics,

controllers, logic, analog, memory, comparators

and more using BiCMOS, CMOS or other

silicon/GaAs technologies are well addressed by

Amkor's CSSOP product family.

The CSSOP offers a variety of features:

• 20 & 24 lead counts (Others available when tooled)

• 150 mil body size (Others available when tooled)

• Hermetic package

• High thermal conductive ceramic

• Matte Tin Plate lead finish

• JEDEC and EIAJ package outline standard compliant

• Wide selection of cavity sizes to meet most

die size needs

• Commercial or full Military flows

DS808

Rev Date: 08’02

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