LEADFRAME

Data Sheet

Questions? Contact us: marketing@amkor.com

Visit Amkor Technology online for locations and

to view the most current product information.

Thermal Performance

Forced Convection, Single-layer PCB

Pkg

Body Size

(mm)

Pad Size

(mm)

ΘJA (°C/W) by Velocity (LFPM)

0

200

500

20 ld

3.9 x 8.7

2.4 x 3.6

80.8

73.2

69.2

28 ld

5.3 x 10.2

3.84 x 8.10

49.0

36.0

30.0

JEDEC Standard Test Boards

Electrical Performance

Pkg

Body

Size

(mm)

Pad

Size

(mm)

Lead

Self

Inductance

(nH)

Bulk

Capacitance

(pF)

Self

Resistance

(mF)

20 ld 5.3 x 7.2 3.9 x 5.4 Longest

Shortest

2.260

0.958

0.395

0.209

19.0

9.10

28 ld 3.9 x 9.9 2.4 x 4.8 Longest

Shortest

1.590

0.757

0.376

0.198

14.1

7.53

28 ld 5.3 x 10.2 3.9 x 5.1 Longest

Shortest

2.510

0.928

0.463

0.206

21.5

9.57

Simulated Results @ 100 MHz

Reliability Qualification

Amkor package qualification uses three independent production lots and a

minimum of 77 units per test group. All testing includes JSTD-020 moisture

preconditioning.

• Moisture Sensitivity

JEDEC Level 1, 85°C/85% RH, 168 hrs

Characterization

JEDEC Level 3, 30°C/60% RH, 192 hrs

• uHAST

130°C/85% RH, No Bias, 96 hrs

• Temp Cycle

-65°C/+150°C, 500 cycles

• High Temp Storage

150°C, 1000 hours

Process Highlights

• Pcc wire bonding standard, Ag wire available

• Wafer backgrinding services available

• Multiple die and die stacking capability

• NiPdAu (PPF) or Matte Sn lead finish options

• Laser mark on package body

DS360N

Rev Date: 7/15

SSOP/QSOP

Shrink Small Outline,

Quarter-Size Small-Outline Packages

(SSOP/QSOP)

SSOP and QSOP are leadframe based, plastic

encapsulated packages that are well suited for applications

requiring optimum performance in IC packaging with

compressed body size and tightened lead pitch. These

industry standard IC packages yield a significant reduction

in size while running in high volume and provide value

added low cost solutions for a wide range of applications. A

green BOM is standard, allowing devices to meet applicable

Pb-free and RoHS standards.

Features

• Cu wire interconnect for low cost

• Standard JEDEC package outlines

• Multi-die production capability

• Turnkey test services, including strip test options

• Green materials are standard – Pb-free and RoHS

compliant

New Developments

• Stealth dicing (narrow saw streets)

• Larger/higher density leadframe strips

• Leadframe roughening for improved MSL capability

Services and Support

Amkor has a broad base of resources available to help

customers bring quality new products to market quickly and

at the lowest possible cost.

• Full package characterization

• Thermal, mechanical stress and electrical performance

modeling

• Turnkey assembly, test and drop ship

• World class reliability testing and failure analysis