Summary description
The NAND256-M, NAND512-M and NAND01G-M are Multi-Chip Packages which combine up to 512 Mbit LPSDRAM with a 256 Mbit, 512 Mbit or 1 Gbit NAND Flash memory. This combination of LPSDRAM and NAND Flash can result in up to 1 Gbit of memory.

Features
■ Multi-Chip Packages
    – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 1 die of 256 Mb (x16) SDR LPSDRAM
    – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash + 2 dice of 256 Mb (x16) SDR LPSDRAMs
    – 1 die of 256 Mb, 512 Mb (x8/ x16) NAND Flash +1 die of 256 Mb (x16) DDR LPSDRAM
    – 1 die of 512 Mb (x16) NAND Flash + 1 die of 256 Mb or 512 Mb (x16) DDR LPSDRAM
■ Supply voltages
    – VDDF = 1.7V to 1.95V or 2.5V to 3.6V
    – VDDD = VDDQD = 1.7V to 1.9V
■ Electronic Signature
■ ECOPACK® packages
■ Temperature range
    – -30 to 85°C

Flash Memory
■ NAND Interface
    – x8 or x16 bus width
    – Multiplexed Address/ Data
■ Page size
    – x8 device: (512 + 16 spare) Bytes
    – x16 device: (256 + 8 spare) Words
■ Block size
    – x8 device: (16K + 512 spare) Bytes
    – x16 device: (8K + 256 spare) Words
■ Page Read/Program
    – Random access: 15µs (max)
    – Sequential access: 50ns (min)
    – Page program time: 200µs (typ)
■ Copy Back Program mode
    – Fast page copy without external buffering
■ Fast Block Erase
    – Block erase time: 2ms (typ)
■ Status Register
■ Data integrity
    – 100,000 Program/Erase cycles
    – 10 years Data Retention

LPSDRAM
■ Interface: x16 or x 32 bus width
■ Deep Power Down mode
■ 1.8v LVCMOS interface
■ Quad internal Banks controlled by BA0 and BA1
■ Automatic and controlled Precharge
■ Auto Refresh and Self Refresh
    – 8,192 Refresh cycles/64ms
    – Programmable Partial Array Self Refresh
    – Auto Temperature Compensated Self Refresh
■ Wrap sequence: sequential/interleave
■ Burst Termination by Burst Stop command and Precharge command