Summary description

NAND256-M, NAND512-M, NAND01G-M

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Summary description

The NAND256-M, NAND512-M and NAND01G-M are Multi-Chip Packages which combine

up to 512 Mbit LPSDRAM with a 256 Mbit, 512 Mbit or 1 Gbit NAND Flash memory. This

combination of LPSDRAM and NAND Flash can result in up to 1 Gbit of memory.

The NAND Flash memory and LPSDRAM components have separate power supplies and

grounds. They also have separate control, address and input/output signals, which allows

simultaneous access to both devices at any moment.

for the LPSDRAM. See Figure 1: Logic Diagram: NAND Flash & 1 x SDR LPSDRAM and

Table 2: Signal Names: NAND Flash & 1 x SDR LPSDRAM for an overview of the signals

attached to each component.

The NAND256-M, NAND512-M and NAND01G-M are available with a 1.8 or 3V voltage

supply. See Table 1: Product List for a complete list of the products available.

The devices are offered in the following Multi-Chip packages:

●

TFBGA107 (10.5 x 13 x 1.2mm)

●

LFBGA137 (10.5 x 13 x 1.4mm)

●

TFBGA149 (10 x 13.5 x 1.2mm)

●

TFBGA137 (10.5 x 13 x 1.2mm)

In order to meet environmental requirements, ST offers the NAND256-M, NAND512-M and

category of second Level Interconnect is marked on the package and on the inner box label,

in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

The memories are supplied with all the NAND Flash memory bits erased (set to ‘1’).

This datasheet should be read in conjunction with the NAND Flash and LPSDRAM

datasheets.

NAND Flash Component

The NAND256-M, NAND512-M and NAND01G-M devices contain a 1.8V, 256 Mbit or 512

Mbit, x8 528 Byte Page or x16 264 Word Page, NAND Flash memory with the Chip Enable

Don’t Care option.

For detailed information on how to use the devices, see the NANDxxx-A and

NAND01GWxA2B-KGD datasheets.