FEATURES
• Industry Standard Serial Interface
- IS25LP016D: 16Mbit/2Mbyte
- IS25WP016D: 16Mbit/2Mbyte
- 256 bytes per Programmable Page
- Supports standard SPI, Fast, Dual, Dual
I/O, Quad, Quad I/O, SPI DTR, Dual I/O
DTR, Quad I/O DTR, and QPI
- Supports Serial Flash Discoverable
Parameters (SFDP)
• High Performance Serial Flash (SPI)
- 50MHz Normal and 133Mhz Fast Read
- 532 MHz equivalent QPI
- DTR (Dual Transfer Rate) up to 66MHz
- Selectable Dummy Cycles
- Configurable Drive Strength
- Supports SPI Modes 0 and 3
- More than 100,000 Erase/Program Cycles
- More than 20-year Data Retention
• Flexible & Efficient Memory Architecture
- Chip Erase with Uniform: Sector/Block
Erase (4/32/64 Kbyte)
- Program 1 to 256 Bytes per Page
- Program/Erase Suspend & Resume
• Efficient Read and Program modes
- Low Instruction Overhead Operations
- Continuous Read 8/16/32/64-Byte
Burst Wrap
- Selectable Burst Length
- AutoBoot Operation
• Low Power with Wide Temp. Ranges
- Single Voltage Supply
IS25LP: 2.30V to 3.75V(1)
IS25WP: 1.65V to 1.95V
- 4 mA Active Read Current (typ.)
- 5 μA Standby Current (typ.)
- 1 μA Deep Power Down (typ.)
- Temp Grades:
Extended: -40°C to +105°C
Auto Grade (A3): -40°C to +125°C
Note:
1. 3.6V for Automotive Grade (A3)
• Advanced Security Protection
- Software and Hardware Write Protection
- Power Supply Lock Protect
- 4x256-Byte Dedicated Security Area
with OTP User-lockable Bits
- 128 bit Unique ID for Each Device
(Call Factory)
• Industry Standard Pin-out & Packages(1,2)
- B = 8-pin SOIC 208mil
- N = 8-pin SOIC 150mil
- V = 8-pin VVSOP 150mil
- K = 8-contact WSON 6x5mm
- U = 8-contact USON 2x3mm
- T = 8-contact USON 4x3mm
- M = 16-pin SOIC 300mil (Call Factory)
- L = 8-contact WSON 8x6mm
- G= 24-ball TFBGA 6x8mm 4x6(Call Factory)
- H = 24-ball TFBGA 6x8mm 5x5 (Call Factory)
- W = KGD (Call Factory)
- Green Package (RoHS Compliant,
Halogen-Free) and TSCA Compliant