| 制造商 | 部件名 | 数据表 | 功能描述 |
 Motorola, Inc |
AN1580
|
126Kb / 4P |
MOUNTING AND SOLDERING RECOMMENDATIONS FOR THE MOTOROLA POWER FLAT PACK PACKAGE
|
 Freescale Semiconductor... |
AN3150
|
183Kb / 4P |
Soldering Recommendations for Pressure Sensor Devices
|
 M/A-COM Technology Solu... |
AN4002
|
41Kb / 1P |
Recommendations For Long -Term Transistor Storage
|
 STMicroelectronics |
AN2354
|
265Kb / 21P |
ST10 UART recommendations
25-Sep-2013 |
|
AN1235
|
257Kb / 14P |
package description and recommendations for use
19-Oct-2012 |
|
AN2348
|
267Kb / 17P |
package description and recommendations for use
19-Oct-2012 |
|
AN4208
|
288Kb / 16P |
package description and recommendations for use
05-Aug-2013 |
|
TN1200
|
286Kb / 16P |
package description and recommendations for use
10-Dec-2014 |
|
AN3232
|
1Mb / 26P |
Mounting recommendations
31-Aug-2011 |
|
TN1163
|
651Kb / 21P |
Description of WLCSP for microcontrollers and recommendations for use
25-Jun-2014 |