| 制造商 | 部件名 | 数据表 | 功能描述 |
 National Semiconductor ... |
MKT-E32B
|
31Kb / 1P |
LEADLESS CHIP CARRIER, TYPE C, 32 TERMINAL
|
 Microsemi Corporation |
1N4614UR-1
|
122Kb / 2P |
LEADLESS PACKAGE FOR SURFACE MOUNT
|
 Vishay Siliconix |
PL340
|
140Kb / 2P |
Plastic Leadless Chip Carrier
14-Nov-02 |
 Mitsubishi Electric Sem... |
MGF4953A
|
205Kb / 5P |
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
|
|
MGF4851A
|
136Kb / 5P |
SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
|
|
MGF1952A
|
150Kb / 5P |
Microwave Power MES FET (Leadless Ceramic Package)
|
|
MGF4953B
|
119Kb / 5P |
SUPER LOW NOISE InGaAs HEMT Leadless Ceramic Package
|
 Amkor Technology |
LCC
|
459Kb / 1P |
Leadless Chip Carrier Package
|
 Microsemi Corporation |
BZV55C7V5
|
24Kb / 1P |
LEADLESS PACKAGE FOR SURFACE MOUNT
|
 TT Electronics. |
BCN31
|
274Kb / 3P |
Leadless Chip Packages
|