HMC557ALC4 pdf, HMC557ALC4 功能描述, HMC557ALC4 数据表, HMC557ALC4 view ::: ALLDATASHEET :::

部件名	HMC557ALC4

功能描述	24-terminal ceramic leadless chip carrier package

文件大小	348.87 Kbytes

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制造商	AD [Analog Devices]

网页	http://www.analog.com

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类似零件编号 - HMC557ALC4

制造商	部件名	数据表	功能描述
Hittite Microwave Corpo...	HMC557	230Kb / 6P	GaAs MMIC FUNDAMENTAL MIXER, 2.5 - 7.0 GHz
Hittite Microwave Corpo...	HMC557	222Kb / 6P	GaAs MMIC FUNDAMENTAL MIXER, 2.5 - 7.0 GHz
Micross Components	HMC557	876Kb / 9P	Microwave Radio
Hittite Microwave Corpo...	HMC557LC4	203Kb / 6P	GaAs MMIC FUNDAMENTAL MIXER, 2.5 - 7.0 GHz
Hittite Microwave Corpo...	HMC557LC4	188Kb / 6P	GaAs MMIC FUNDAMENTAL MIXER, 2.5 - 7.0 GHz

制造商	部件名	数据表	功能描述
National Semiconductor ...	MKT-E32B	31Kb / 1P	LEADLESS CHIP CARRIER, TYPE C, 32 TERMINAL
Microsemi Corporation	1N4614UR-1	122Kb / 2P	LEADLESS PACKAGE FOR SURFACE MOUNT
Vishay Siliconix	PL340	140Kb / 2P	Plastic Leadless Chip Carrier 14-Nov-02
Mitsubishi Electric Sem...	MGF4953A	205Kb / 5P	SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
	MGF4851A	136Kb / 5P	SUPER LOW NOISE InGaAs HEMT (Leadless Ceramic Package)
	MGF1952A	150Kb / 5P	Microwave Power MES FET (Leadless Ceramic Package)
	MGF4953B	119Kb / 5P	SUPER LOW NOISE InGaAs HEMT Leadless Ceramic Package
Amkor Technology	LCC	459Kb / 1P	Leadless Chip Carrier Package
Microsemi Corporation	BZV55C7V5	24Kb / 1P	LEADLESS PACKAGE FOR SURFACE MOUNT
TT Electronics.	BCN31	274Kb / 3P	Leadless Chip Packages