MF1ICS5005 pdf, MF1ICS5005 功能描述, MF1ICS5005 数据表, MF1ICS5005 view ::: ALLDATASHEET :::

部件名	MF1ICS5005

功能描述	Standard Card IC Specification ?쐀umped sawn wafer on UV-tape?

文件大小	35.31 Kbytes

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制造商	PHILIPS [NXP Semiconductors]

网页	http://www.nxp.com

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类似零件编号 - MF1ICS5005

制造商	部件名	数据表	功能描述
NXP Semiconductors	MF1ICS50	326Kb / 20P	Functional specification Public transportation Rev. 5.6-24 November 2010
NXP Semiconductors	MF1ICS50	326Kb / 20P	Functional specification Public transportation Rev. 5.6-24 November 2010

制造商	部件名	数据表	功能描述
NXP Semiconductors	MF1ICS2005	90Kb / 7P	Sawn bumped 120關m wafer addendum Rev. 3.0 - 18 July 2007
NXP Semiconductors	MF1ICS7001	293Kb / 7P	Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1-18 April 2007
Roithner LaserTechnik G...	ERYF_STAR	93Kb / 4P	UV-index sensor based on SiC
Taiyo Yuden (U.S.A.), I...	FAR-F6KA-2G1400-D4CG-Z	224Kb / 5P	Standard specification
Silicon Laboratories	SI1133	1,009Kb / 43P	UV Index/Ambient Light Sensor IC with IC Interface
NICHIA CORPORATION	NLSU04S01B-E	364Kb / 13P	SPECIFICATIONS FOR UV STANDARD LED
SunLED Corporation	XLCBD12W	231Kb / 3P	Available on tape and reel
SunLED Corporation	XLFBB12W	230Kb / 3P	Available on tape and reel
Axiomtek Co., Ltd.	FIC	380Kb / 1P	CompactFlash specification standard
NXP Semiconductors	SL2ICS20	44Kb / 12P	SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification December 2002