| 制造商 | 部件名 | 数据表 | 功能描述 |
 NXP Semiconductors |
MF1ICS5005
|
35Kb / 7P |
Standard Card IC Specification ?쐀umped sawn wafer on UV-tape?
August 2004 |
|
MF1ICS7001
|
293Kb / 7P |
Standard 4Kbyte card IC sawn wafer on UV-tape addendum
Rev. 3.1-18 April 2007 |
 Freescale Semiconductor... |
MC9S08GB60
|
75Kb / 4P |
Addendum
|
 M/A-COM Technology Solu... |
MASW-009590
|
227Kb / 4P |
Bumped GaAs SPDT Switch
|
 Texas Instruments |
TLV5614IYZ
|
666Kb / 25P |
12-Bit, Quad Channel, 2.7V to 5.5V, DAC in Bumped Die (Wafer Chip Scale) Package?봒b-Free/Green
|
 M/A-COM Technology Solu... |
MASW-009276-001DIE
|
290Kb / 5P |
Bumped GaAs SP3T Switch
|
|
MASW-009590
|
227Kb / 4P |
Bumped GaAs SPDT Switch
|
|
MASW-008902-000DIE
|
308Kb / 5P |
Bumped GaAs SP3T Switch
|
 STMicroelectronics |
TN0193
|
117Kb / 6P |
LRIS64K bumped die description
05-Jul-2010 |
 NXP Semiconductors |
SL2ICS20
|
44Kb / 12P |
SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification
December 2002 |