MF1ICS2005 pdf, MF1ICS2005 功能描述, MF1ICS2005 数据表, MF1ICS2005 view ::: ALLDATASHEET :::

部件名	MF1ICS2005

功能描述	Sawn bumped 120關m wafer addendum

文件大小	90.14 Kbytes

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制造商	NXP [NXP Semiconductors]

网页	http://www.nxp.com

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类似零件编号 - MF1ICS2005

制造商	部件名	数据表	功能描述
NXP Semiconductors	MF1ICS50	326Kb / 20P	Functional specification Public transportation Rev. 5.6-24 November 2010
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	MF1ICS5005W1D	35Kb / 7P	Standard Card IC Specification ?쐀umped sawn wafer on UV-tape? August 2004
	MF1ICS50	326Kb / 20P	Functional specification Public transportation Rev. 5.6-24 November 2010

制造商	部件名	数据表	功能描述
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NXP Semiconductors	MF1ICS7001	293Kb / 7P	Standard 4Kbyte card IC sawn wafer on UV-tape addendum Rev. 3.1-18 April 2007
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M/A-COM Technology Solu...	MASW-009276-001DIE	290Kb / 5P	Bumped GaAs SP3T Switch
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STMicroelectronics	TN0193	117Kb / 6P	LRIS64K bumped die description 05-Jul-2010
NXP Semiconductors	SL2ICS20	44Kb / 12P	SL2 ICS 20 I?CODE SLI Label IC Bumped Wafer Specification December 2002