1.

General description

The MF1 IC S20 05 is a contactless Smart Card IC designed for card IC coils following the

“Mifare card IC coil design guide” and is qualified to work properly in NXP´ reader

environment, which is built according to NXP´ specification.

This specification describes electrical, physical and dimensional properties of wafers.

2.

Ordering information

3.

Mechanical specification

3.1 Wafer

8”

120

µm ± 15 µm

not applicable

24892

3.2 Wafer backside

Si

ground and stress relieve

3.3 Chip dimensions

1.11 x 1.06 mm

x-line: 80

µm

y-line: 80

µm

3.4 Passivation

sandwich structure

PSG / Nitride

MF1 IC S20 05

Sawn bumped 120µm wafer addendum

Rev. 3.0 — 18 July 2007

Product data sheet

141130

PUBLIC

Table 1.

Ordering information

Type number

Package

Name

Description

Ordering Code

MF1ICS2005W/U7D

Die on sawn wafer

9352 851 56005