| 制造商 | 部件名 | 数据表 | 功能描述 |
 Motorola, Inc |
AN1580
|
126Kb / 4P |
MOUNTING AND SOLDERING RECOMMENDATIONS FOR THE MOTOROLA POWER FLAT PACK PACKAGE
|
 Freescale Semiconductor... |
AN3150
|
183Kb / 4P |
Soldering Recommendations for Pressure Sensor Devices
|
 List of Unclassifed Man... |
SP-301
|
883Kb / 1P |
Solder Pots For lead-Free Soldering
|
 STMicroelectronics |
AN1235
|
257Kb / 14P |
package description and recommendations for use
19-Oct-2012 |
|
AN2348
|
267Kb / 17P |
package description and recommendations for use
19-Oct-2012 |
|
AN4208
|
288Kb / 16P |
package description and recommendations for use
05-Aug-2013 |
|
TN1200
|
286Kb / 16P |
package description and recommendations for use
10-Dec-2014 |
|
TN1163
|
651Kb / 21P |
Description of WLCSP for microcontrollers and recommendations for use
25-Jun-2014 |
 STANLEY ELECTRIC CO.,LT... |
VCKB1111CS-TR
|
553Kb / 22P |
Lead-free soldering compatible
|
|
VSTL1156GSE-TR
|
734Kb / 26P |
Lead-free soldering compatible
|