| 制造商 | 部件名 | 数据表 | 功能描述 |
 National Semiconductor ... |
MTD48
|
62Kb / 1P |
48 Lead Molded Thin Shrink Small Outline Package, JEDEC
|
 NXP Semiconductors |
SOT340-1
|
11Kb / 1P |
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
2003 Mar 24 |
 National Semiconductor ... |
MTC16
|
70Kb / 1P |
16 Lead Molded Thin Shrink Small Outline Package, JEDEC NS Package Number MTC16
|
 STMicroelectronics |
TSSO20
|
57Kb / 4P |
20-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 fujitsu semiconductor |
FPT-20P-M04
|
37Kb / 1P |
THIN SHRINK SMALL OUTLINE PACKAGE
|
 Amkor Technology |
CSSOP
|
304Kb / 1P |
Ceramic Shrink Small Outline Package
|
 STMicroelectronics |
TSSOP14
|
58Kb / 4P |
14-LEAD THIN SHRINK SMALL OUTLINE
Nov-2002 |
 Analog Devices |
RQ-16
|
60Kb / 1P |
16-Lead Shrink Small Outline Package [QSOP] Dimensions shown in inches
|
 ACCUTEK MICROCIRCUIT CO... |
AK16D300
|
79Kb / 3P |
Shrink Small Outline Package SSOP DIP Adapters
|
 Guangdong Youtai Semico... |
LM75B
|
312Kb / 23P |
plastic thin shrink small outline package; 8 leads;
|