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STWBC-EP 数据表(PDF) 28 Page - STMicroelectronics |
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STWBC-EP 数据表(HTML) 28 Page - STMicroelectronics |
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28 / 32 page ![]() Thermal characteristics STWBC-EP 28/32 DocID030747 Rev 1 7 Thermal characteristics The STWBC-EP functionality cannot be guaranteed when the device is operating under the maximum chip junction temperature (TJmax). TJmax, in degrees Celsius, may be calculated using the following equation: TJmax = TAmax + (PDmax x JA) where: TAmax is the maximum ambient temperature in °C. ΘJA is the package junction to ambient thermal resistance in °C/W. PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax). PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power. PI/Omax represents the maximum power dissipation on output pins where: PI/Omax = (VOL * IOL) + [(VDD - VOH) * IOH], taking into account the actual VOL/IOL and VOH/IOH of the I/Os at the low and high level. Table 15. Thermal characteristics Symbol Parameter Value Unit JA Thermal resistance junction ambient(1) 1. Thermal resistances are based on JEDEC JESD51-2 with the 4-layer PCB in a natural convection environment. 26 °C/W |
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