MAT02

3.1

Thermal Characteristics:

Thermal Resistance, TO-78 (H) Package

Derate linearly at 6.67 mW/°C for ambient temperatures above 70°C.

Terminal Connections 1/

Terminal

6 lead TO

1

C1

2

B1

3

E1

4

E2

5

B2

6

C2

1/ Substrate is connected to case on TO-78 package. Substrate is normally connected to the most

negative circuit potential, but can be floated.

Table I

Parameter

See notes at end of table

Symbol

Conditions 1/

Sub-

group

Limit

Min

Limit

Max

Units

Current Gain

1

500

2, 3

275

1

500

2, 3

225

1

400

2, 3

175

1

300

2, 3

150

Current Gain Match 2/

h

FE

1

2

%

Offset Voltage

1

50

V

2, 3

80

Offset Voltage vs. Temperature

5/

0.3

V/°C

V

OS

1

25

V

Offset Voltage vs. Collector

Current

V

1

25

Input Offset Current

1

0.6

nA

2, 3

9.0

I

OS

1

70

pA/V

Bulk Emitter Resistance

1

0.5

