Data Sheet

VSC7127/VSC7129

Family of Repeater/Retimer and Port

Bypass Circuits for Fibre Channel

G52298-0, Rev 4.3

Page 11

05/01/01

© VITESSE SEMICONDUCTOR CORPORATION • 741 Calle Plano • Camarillo, CA 93012

Tel: (800) VITESSE • FAX: (805) 987-5896 • Email: prodinfo@vitesse.com

Internet: www.vitesse.com

VITESSE

SEMICONDUCTOR CORPORATION

Package Thermal Characteristics

The VSC7127/VSC7129 is packaged in a standard plastic quad flatpack, PQFP, with an embedded, but

unexposed thermal heatslug. This package adheres to industry-standard EIAJ footprints for a 10 mm body, 44

lead PQFP. The package construction is as shown in Figure 6. The 44 PQFP with embedded slug has the thermal

properties shown in Figure 6.

Figure 6: Package Cross Section—10 mm package

Table 5: 44 PQFP Thermal Resistance

tee that the case temperature specification is not violated. With the thermal resistances shown in Table 5, the

temperature exceeds these limits, some form of cooling through a heatsink or an increase in airflow must be pro-

vided.

Moisture Sensitivity Level

This device is rated at a Moisture Sensitivity Level 3 rating with maximum floor life of 168 hours at 30ºC,

60% relative humidity. Please refer to Application Note AN-20 for appropriate handling procedures.

Symbol

Description

Value

Units

θ

CA-0

Thermal resistance from case-to-ambient, still air

50

θ

CA-100

Thermal resistance from case-to-ambient, 100 LFPM air

43

θ

CA-200

Thermal resistance from case-to-ambient, 200 LFPM air

39

θ

CA-400

Thermal resistance from case-to-ambient, 400 LFPM air

36

θ

CA-600

Thermal resistance from case-to-ambient, 600 LFPM air

34

Copper Heat Spreader

Die

Plastic Molding Compound

Lead

Bond Wire