LTPL-P033RGB datasheet(8/14 Pages) LITEON

8 / 14 page

7/13 PartNo.:LTPL-P033RGB

BNS-OD-FC002/A4

Specific lighting

LTPL-P033RGB

5. Reflow Soldering Characteristics

Time

Preheat, t

Smin

Smax

°C to Peak, t

Ramp-dow n

Ramp-up

Profile Feature

Lead Free Assembly

Average Ramp-Up Rate (TSmax to TP)

3°C / second max

Preheat Temperature Min (TSmin)

150°C

Preheat Temperature Max (TSmax)

200°C

Preheat Time (tSmin to tSmax)

60 – 180 seconds

Time Maintained Above Temperature (TL)

217°C

Time Maintained Above Time (tL)

60 – 150 seconds

Peak / Classification Temperature (TP)

260°C

Time Within 5°C of Actual Peak Temperature (t P)

5 seconds

Ramp – Down Rate

6°C / second max

Time 25°C to Peak Temperature

8 minutes max

Notes:

1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended

hand soldering condition is 350°C max. and 2secs ma x. for one time only.

2. All temperatures refer to topside of the package, measured on the package body surface.

3. The soldering profile could be further referred to different soldering grease material characteristic. The

grease vendor will provide this information.

4. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature.

5. Although the recommended reflow conditions are specified above, the reflow or hand soldering

condition at the lowest possible temperature is desirable for the LEDs.

6. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip

soldering method.

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