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Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

ProDuCt DEsCriPtion

unprecedented levels of light output

and efficacy for a single die LED. The

XLamp XP-G LeD continues Cree’s

history of innovation in LEDs for lighting

applications with wide viewing angle,

symmetrical package, unlimited floor life

and electrically neutral thermal path.

XLamp XP-G LeDs are the ideal choice

for lighting applications where high

light output and maximum efficacy are

required, such as LeD light bulbs, outdoor

lighting, portable lighting, indoor lighting

and solar-powered lighting.

FEAturEs

• Available in white, outdoor white and

80-CRI, 85-CRI and 90-CRI white

• ANSI-compatible chromaticity bins

• Maximum drive current: 1500 mA

• Low thermal resistance: 4 °C/W

• Wide viewing angle: 125°

• Unlimited floor life at

≤ 30 ºC/85% RH

• Reflow solderable - JEDEC J-STD-020C

• Electrically neutral thermal path

• RoHS and REACh compliant

tAbLE oF ContEnts

Characteristics ............................................2

Flux Characteristics ....................................3

Relative Spectral Power Distribution .........7

Relative Flux vs. Junction Temperature.....7

electrical Characteristics............................8

Relative Flux vs. Current .............................8

Relative Chromaticity vs Current and

Temperature ................................................9

Typical Spatial Distribution...................... 10

Thermal Design........................................ 10

Performance Groups – Luminous Flux... 11

Performance Groups – Chromaticity...... 12

Cree’s Standard Chromaticity Regions

Plotted on the 1931 CIE Curve ................ 15

Cree’s Standard Cool White Kits Plotted

on ANSI Standard Chromaticity

Regions..................................................... 17

Cree’s Standard Warm and Neutral

White Kits Plotted on ANSI Standard

Chromaticity Regions .............................. 18

Cree’s Standard Chromaticity Kits .......... 20

Bin and Order Code Formats................... 21

Reflow Soldering Characteristics............ 22

Notes ........................................................ 23

Mechanical Dimensions .......................... 25

Tape and Reel........................................... 27

Packaging................................................. 28