vendor endorsement, sponsorship or association.

26

MEChAniCAL DiMEnsions (t

All measurements are ±.13 mm unless otherwise indicated.

Notes:

•

Cree recommends using thermal pad kickouts to maximize component thermal performance.

•

Cree recommends using white solder mask material to minimize system optical loss.

*

other solder pastes, a “window pane” design for the thermal pad stencil may result in a lower voiding percentage. Contact your local

Cree Field Applications Engineer for consultation regarding your specific application.

recommended solder Pad

(solder Mask pattern)

recommended stencil openings*

SIZE

TITLE

OF

REV.

SHEET

C

DRAWING NO.

DATE

DATE

DATE

CHECK

FINAL PROTECTIVE FINISH

MATERIAL

APPROVED

DRAWN BY

THIRD ANGLE PROJECTION

SCALE

A

B

C

D

1

2

3

4

5

6

6

5

4

3

2

1

A

B

C

D

Phone (919) 313-5300

Fax (919) 313-5558

4600 Silicon Drive

Durham, N.C 27703

UNAUTHORIZED PERSON WITHOUT

THE WRITTEN CONSENT

MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY

CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT

CONTAINED WITHIN ARE THE PROPRIETARY AND

CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION

OF CREE INC.

NOTICE

X° ± .5°

.XXX± .25

.XX ± .75

.X ± 1.5

FOR SHEET METAL PARTS ONLY

.XX ± .25

.XXX± .125

X° ± .5°

UNLESS OTHERWISE SPECIFIED

DIMENSIONS ARE IN

MILLIMETERS AND AFTER FINISH.

TOLERANCE UNLESS SPECIFIED:

SURFACE FINISH:

1.6

3.30

3.30

.73

2.26

R1.53

1.30

.50

2.30

.50

3.45

3.45

.58

3.30 REF.

3.30 REF.

3.50

.70

.30

1.50

.30

3.50

3.30

.50

.50

1.30

.50

3.30

.90

.25

.90

.25

3.20

.40

.72

.96

.72

3.20

1

/

1

22.000

D

2610-00066

OUTLINE DRAWING XPG G3

10/6/15

D. CRONIN

REVISONS

REV

DESCRIPTION

BY DATE APP'D

RECOMMENDED SOLDER PAD

(SOLDER RESIST PATTERN)

ALL DIMENSIONS ARE ± .13MM UNLESS OTHERWISE NOTED

PRIMARY

ALTERNATIVE

OPTICAL

REFERENCE

RECOMMENDED COPPER LAYOUT

RECOMMENDED STENCIL OPENINGS

OPTICAL

REFERENCE

recommended Copper Layout