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70V

Input Voltage

55V

Inter-Emitter Voltage (Note 3)

55V

Output Voltage (Note 4)

DS55451DS75451 DS55452DS75452

30V

DS55453DS75453 DS55454DS75454

Output Current (Note 5)

DS55451DS75451 DS55452DS75452

300 mA

DS55453DS75453 DS55454DS75454

DS75451234 Maximum Power (Note 5)

Dissipation at 25 C

Cavity Package

1090 mW

Molded DIP Package

957 mW

TO-5 Package

760 mW

SO Package

632 mW

Storage Temperature Range

b

Lead Temperature (Soldering 4 sec)

260 C

Operating Conditions

Min

Max

Units

DS5545X

45

55

V

DS7545X

475

525

V

DS5545X

b

55

a

125

C

DS7545X

0

a

70

C

Derate cavity package 73 mW C above 25 C derate molded package

77 mW C above 25 C derate TO-5 package 51 mW C above 25 C

derate SO package 756 mW C above 25 C

Electrical Characteristics

DS55451DS75451 DS55452DS75452 DS55453DS75453 DS55454DS75454 (Notes 6 and 7)

Symbol

Parameter

Conditions

Min Typ

Max

Units

High-Level Input Voltage

(Figure 7)

2V

Low-Level Input Voltage

08

V

Input Clamp Voltage

b

15

V

Low-Level Output Voltage

DS55451 DS55453

025

05

V

(Figure 7)

DS75451 DS75453

025

04

V

DS55451 DS55453

05

08

V

DS75451 DS75453

05

07

V

DS55452 DS55454

025

05

V

DS75452 DS75454

025

04

V

DS55452 DS55454

05

08

V

DS75452 DS75454

05

07

V

High-Level Output Current

DS55451 DS55453

300

m

A

(Figure 7)

DS75451 DS75453

100

m

A

DS55452 DS55454

300

m

A

DS75452 DS75454

100

m

A

Input Current at Maximum

1mA

Input Voltage

High-Level Input Current

40

m

A

Low-Level Input Current

b

1

b

16

mA

DS55451DS75451

7

11

mA

(Figure 10)

DS55452DS75452

11

14

mA

DS55453DS75453

8

11

mA

DS55454DS75454

13

17

mA

Supply Current Outputs Low

DS55451DS75451

52

65

mA

(Figure 10)

DS55452DS75452

56

71

mA

DS55453DS75453

54

68

mA

DS55454DS75454

61

79

mA

2