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LTC1644IGN 数据表(PDF) 20 Page - Linear Technology |
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LTC1644IGN 数据表(HTML) 20 Page - Linear Technology |
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20 / 24 page ![]() LTC1644 20 1644f C1 0.047 µF GND 5VIN 5VIN D1 5VSENSE 13 5VOUT 3 3VIN LTC1644* 17 3VOUT 18 3VSENSE 16 14 GATE 15 8 R4 10 Ω 5VOUT 1644 F13 R5 1k R2 0.007 Ω Q2 IRF7413 D2 NC Z4 D1, D2: BAV99 Z4: 1PMT5.0AT3 *ADDITIONAL PINS OMITTED FOR CLARITY PCB EDGE BACKPLANE CONNECTOR BACKPLANE CONNECTOR 5V LONG 5V GROUND R22 2.74 Ω C6 0.01 µF C9 0.1 µF PER 10 POWER PINS Figure 13. No 3.3V Supply Application Circuit APPLICATIO S I FOR ATIO Figure 14. BD_SEL# Pushbutton Toggle Switch GND LTC1644* 8 1.2k PUSHBUTTON SWITICH 100 Ω 5VIN 1k GROUND OFF/ON 5 BD_SEL# 1644 F14 *ADDITIONAL PINS OMITTED FOR CLARITY PCB EDGE BACKPLANE CONNECTOR BACKPLANE CONNECTOR restricts the choice of power MOSFETs to those devices with very low RDS(ON). Table 9 lists some power MOSFETs that can be used with the LTC1644. Power MOSFETs are classified into two categories: stan- dard MOSFETs (RDS(ON) specified at VGS = 10V) and logic- level MOSFETs (RDS(ON) specified at VGS = 5V). Since external pass transistors are required for the 3.3V and 5V supply rails, logic-level power MOSFETs should be used with the LTC1644. Overvoltage Transient Protection Good engineering practice calls for bypassing the supply rail of any analog circuit. Bypass capacitors are often placed at the supply connection of every active device, in addition to one or more large-value bulk bypass capacitors per supply rail. If power is connected abruptly, the large bypass capacitors slow the rate of rise of the supply voltage and heavily damp any parasitic resonance of lead or PC track inductance working against the supply bypass capacitors. The opposite is true for LTC1644 Hot Swap circuits mounted on plug-in cards. In most cases, there is no supply bypass capacitor present on the powered 12V (12VIN), –12V (VEEIN) of the PCB edge connector or on the 3.3V (3VIN) or the 5V (5VIN) side of the MOSFET switch. An abrupt connection, produced by inserting the board into a backplane connector, results in a fast rising edge applied on these input supply lines of the LTC1644. Since there is no bulk capacitance to damp the parasitic track inductance, supply voltage transients excite para- sitic resonant circuits formed by the power MOSFET capacitance and the combined parasitic inductance from the wiring harness, the backplane and the circuit board traces. These ringing transients appear as a fast edge on the input supply lines, exhibiting a peak overshoot up to 2.5 times the steady-state value followed by a damped |
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