LP3209-01

Jul.-2017

www.lowpowersemi.com

Page 3 of 10

Preliminary Datasheet

LP3209

Function Diagram

osc

Slope

compensation

Control

logic

Current limit

Comp.

Current comp.

0.6V

REF

VIN

EN

1

5

VFB

VREF

EA

Over voltege

Comp.

0.6V

VIN

LX

GND

4

3

2

PWM

Comp.

+

+

+

+

+

-

-

-

-

-

shutdown

VREF

Absolute Maximum Ratings

Note 1



Input Voltage to GND --------------------------------------------------------------------------------------------------- 6.5V



SW to GND (VLX) ------------------------------------------------------------------------------------ -0.3V to VIN +0.3V



FB to GND (VFB) ------------------------------------------------------------------------------------- -0.3V to VIN +0.3V



EN to GND (VEN) ------------------------------------------------------------------------------------- -0.3V to VIN+0.3V



Maximum Junction Temperature ---------------------------------------------------------------------------------- 150°C







Maximum Soldering Temperature (at leads, 10sec) --------------------------------------------------------- 260℃

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational

sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Thermal Information





ESD Susceptibility



HBM(Human Body Mode) --------------------------------------------------------------------------------------------- 2KV



MM(Machine Mode) --------------------------------------------------------------------------------------------------- 200V