LP28301 datasheet(3/9 Pages) POWER

3 / 9 page

LP28301-02

Mar.-2017

Email: marketing@lowpowersemi.com

www.lowpowersemi.com

Page 3 of 9

Preliminary Datasheet

LP28301

Typical Application Circuit

VIN

STAT

VDDP

VBAT

NTC

FULL

LP28301

4.7uH

Battery

LPM9006B3F

Low side

NMOS

COUT

22uF

High side

NMOS

LPM9006B3F

CBAT

10uF

VSNS

VDDA

RISET

RIREF

CCOM

CIN

10uF

VBUS

D-

D+

GND

MICRO USB

REG

CONTROL

CVDDP

4.7uF

CVDDA

1uF

LED1

LED2

0.1Ω

22Ω

BST

VDDP

CBST

1uF

GNDP

Absolute Maximum Ratings

Note 1



Input to GND(VIN) -------------------------------------------------------------------------------------------- -0.3V to 18V



Other Pin to GND -------------------------------------------------------------------------------------------- -0.3V to 6.5V



LX voltage to GND ------------------------------------------------------------------------------------------- -0.3V to 18V



HDR,BST voltage to GND ---------------------------------------------------------------------------------- -0.3V to 23V



BST referred to LX ------------------------------------------------------------------------------------------ -0.3V to 6.5V



BAT Short-circuit Duration ----------------------------------------------------------------------------------- Continuous



Maximum Junction Temperature ---------------------------------------------------------------------------------- 150℃



Storage Temperature ------------------------------------------------------------------------------------- -45℃ to 165℃



Operating Ambient Temperature Range (TA) -------------------------------------------------------- -40℃ to 85℃



Maximum Soldering Temperature (at leads, 10 sec) -------------------------------------------------------- 260℃

Note 1.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational

sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Thermal Information



Maximum Power Dissipation (QFN-28, PD, TA=25℃) ---------------------------------------------------------- 2W



Thermal Resistance (QFN-28, θJA) ---------------------------------------------------------------------------- 50℃/W

ESD Susceptibility



HBM(Human Body Mode) --------------------------------------------------------------------------------------------- 2KV



MM(Machine Mode) --------------------------------------------------------------------------------------------------- 200V

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