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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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LDW5AM 数据表(PDF) 17 Page - OSRAM GmbH |
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LDW5AM 数据表(HTML) 17 Page - OSRAM GmbH |
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17 / 22 page  Released LD W5AM, LB W5AM, LT W5AM 2010-08-26 17 Empfohlenes Lötpaddesign 5) Seite 22 Reflow Löten Recommended Solder Pad 5) page 22 Reflow Soldering Footprint Empfohlene Padgeometrie Recommended Solder Pad Design Achtung: Anode und Heatsink sind elektrisch verbunden Attention: Anode and Heatsink are electrically connected Solder resist Bare Copper Freies Kupfer Lötpasten Schablone Solder paste stencil Lötstopplack OHPY3637 Kupfer Copper 1.6 (0.063) 11.6 (0.457) 12.0 (0.472) 1.6 (0.063) 11.6 (0.457) 3 Lötstellen 3 solder points Thermal enhanced PCB Thermisch optimiertes PCB ø4.0 (0.157) Heatsink attach ø4.0 (0.157) ø2.5 (0.098) 1 (0.039) |
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