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ADL5320ARKZ-R7 数据表(PDF) 2 Page - Analog Devices |
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ADL5320ARKZ-R7 数据表(HTML) 2 Page - Analog Devices |
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2 / 20 page ![]() ADL5320 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Applications....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications..................................................................................... 3 Typical Scattering Parameters..................................................... 4 Absolute Maximum Ratings............................................................ 5 Thermal Resistance ...................................................................... 5 ESD Caution.................................................................................. 5 Pin Configuration and Function Descriptions............................. 6 Typical Performance Characteristics ............................................. 7 High Temperature and 3.3 V Operation ................................. 11 Applications Information .............................................................. 12 Basic Layout Connections......................................................... 12 Soldering Information and Recommended PCB Land Pattern................................................................................ 13 Matching Procedure................................................................... 14 Optimizing OP1dB .................................................................... 15 W-CDMA ACPR Performance ................................................ 15 Evaluation Board ............................................................................ 16 Outline Dimensions ....................................................................... 18 Ordering Guide .......................................................................... 18 REVISION HISTORY 10/13—Rev. A to Rev. B Changed 1805 MHz to 2110 MHz .............................. Throughout Changes to Figure 27...................................................................... 10 Changes to Figure 34 and Table 6................................................. 12 Changes to Figure 35...................................................................... 13 Changes to Matching Procedures Section................................... 14 Added Optimizing OP1dB Section, Table 10, Table 11, Table 12, and Figure 39; Renumbered Sequentially ................... 15 Changes to Evaluation Board Section............................................. 16 Updated Outline Dimensions ....................................................... 18 Changes to Ordering Guide .......................................................... 18 6/12—Rev. 0 to Rev. A Changes to Features Section and General Description Section........ 1 Added Application Section and Figure 2; Renumbered Sequentially ....................................................................................... 1 Changes to Specifications Section .................................................. 3 Deleted θJC (Junction to Paddle) Parameter, Table 3.................... 5 Changes to Operating Temperature Range Parameter, Table 3 .................................................................................................5 Added Thermal Resistance Section and Table 4; Renumbered Sequentially ........................................................................................5 Added EPAD Notation to Figure 3 .................................................6 Added Figure 27 ............................................................................. 10 Added High Temperature and 3.3 V Operation Section and Figure 28 to Figure 33 .................................................................... 11 Added Applications Information Section and Figure 35 .......... 12 Changes to Soldering Information and Recommended PCB Land Pattern .................................................................................... 12 Changed −82 dBc to −80 dBc in W-CDMA ACPR Performance Section.............................................................................................. 14 Added Figure 39 ............................................................................. 14 Updated Outline Dimensions....................................................... 17 2/08—Revision 0: Initial Version Rev. B | Page 2 of 20 |
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