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ADL5320ARKZ-R7 数据表(PDF) 2 Page - Analog Devices

部件名 ADL5320ARKZ-R7
功能描述  RF Driver Amplifier
PDF  20 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADL5320ARKZ-R7 数据表(HTML) 2 Page - Analog Devices

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ADL5320
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Typical Scattering Parameters..................................................... 4
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
High Temperature and 3.3 V Operation ................................. 11
Applications Information .............................................................. 12
Basic Layout Connections......................................................... 12
Soldering Information and Recommended PCB
Land Pattern................................................................................ 13
Matching Procedure................................................................... 14
Optimizing OP1dB .................................................................... 15
W-CDMA ACPR Performance ................................................ 15
Evaluation Board ............................................................................ 16
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 18
REVISION HISTORY
10/13—Rev. A to Rev. B
Changed 1805 MHz to 2110 MHz .............................. Throughout
Changes to Figure 27...................................................................... 10
Changes to Figure 34 and Table 6................................................. 12
Changes to Figure 35...................................................................... 13
Changes to Matching Procedures Section................................... 14
Added Optimizing OP1dB Section, Table 10, Table 11,
Table 12, and Figure 39; Renumbered Sequentially ................... 15
Changes to Evaluation Board Section............................................. 16
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 18
6/12—Rev. 0 to Rev. A
Changes to Features Section and General Description Section........ 1
Added Application Section and Figure 2; Renumbered
Sequentially ....................................................................................... 1
Changes to Specifications Section .................................................. 3
Deleted θJC (Junction to Paddle) Parameter, Table 3.................... 5
Changes to Operating Temperature Range Parameter,
Table 3 .................................................................................................5
Added Thermal Resistance Section and Table 4; Renumbered
Sequentially ........................................................................................5
Added EPAD Notation to Figure 3 .................................................6
Added Figure 27 ............................................................................. 10
Added High Temperature and 3.3 V Operation Section and
Figure 28 to Figure 33 .................................................................... 11
Added Applications Information Section and Figure 35 .......... 12
Changes to Soldering Information and Recommended PCB
Land Pattern .................................................................................... 12
Changed −82 dBc to −80 dBc in W-CDMA ACPR Performance
Section.............................................................................................. 14
Added Figure 39 ............................................................................. 14
Updated Outline Dimensions....................................................... 17
2/08—Revision 0: Initial Version
Rev. B | Page 2 of 20



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