Data Sheet

AD8352

Rev. C | Page 7 of 19

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

12

11

10

1

3

4

9

2

RDP

RGP

RGN

RDN

GND

VOP

VON

GND

AD8352

TOP VIEW

(Not to Scale)

NOTES

1. THE EXPOSED PAD MUST BE

CONNECTED TO GROUND VIA A

LOW IMPEDANCE PATH, BOTH

THERMALLY AND ELECTRICALLY.

Figure 3. Pin Configuration

Table 4. Pin Function Descriptions

Pin No.

Mnemonic

Description

1

RDP

Positive Distortion Adjust.

2

RGP

Positive Gain Adjust.

3

RGN

Negative Gain Adjust.

4

RDN

Negative Distortion Adjust.

5

VIN

Balanced Differential Input. This pin is biased to VCM, typically ac-coupled.

6, 7, 9, 12

GND

Ground. Connect this pin to low impedance GND.

8, 13

VCC

Positive Supply.

10

VON

Balanced Differential Output. This pin is biased to VCM, typically ac-coupled.

11

VOP

Balanced Differential Output. This pin is biased to VCM, typically ac-coupled.

14

VCM

Common-Mode Voltage. A voltage applied to this pin sets the common-mode voltage of the input and output.

Typically decoupled to ground with a 0.1 µF capacitor. With no reference applied, input and output common

mode floats to midsupply (VCC/2).

15

ENB

Enable. Apply positive voltage (1.3 V < ENB < VCC) to activate device.

16

VIP

Balanced Differential Input. This pin is biased to VCM, typically ac-coupled.

EPAD

Exposed Pad. The exposed pad must be connected to ground via a low impedance path, both thermally and

electrically.