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HIP2104FRAANZ 数据表(PDF) 17 Page - Renesas Technology Corp |
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HIP2104FRAANZ 数据表(HTML) 17 Page - Renesas Technology Corp |
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17 / 21 page ![]() HIP2103, HIP2104 FN8276 Rev 0.00 Page 17 of 21 November 27, 2013 The negative transient on the HS pin is the result of the parasitic inductance of the low-side drain-source conductor path on the PCB. Even the parasitic inductance of the low-side FET body contributes to this transient. When the high-side bridge FET turns off (see Figure 24), as a consequence of the inductive characteristics of a motor load, the current that was flowing in the high-side FET (blue) must rapidly commutate through the low side FET (red). The amplitude of the negative transient impressed on the HS node is (L x di/dt) where L is the total parasitic inductance of the low-side FET drain-source path and di/dt is the rate at which the high-side FET is turned off. With the increasing current levels of new generation motor drives, appropriately clamping of this transient becomes more significant for the proper operation of bridge drivers. Fortunately, the HIP2103, HIP2104 can withstand greater amplitudes of negative transients than what is available in many other bridge drivers. The maximum negative voltage on the HS pin is rated for -10V with no time during limit. Another component of negative voltage is from the body diode of the low side FET during the dead time. When current is flowing from source to drain, the conduction voltage is approximately 1 to 1.5V negative impressed on the HS pin (possibly greater during fault load conditions). Because the HIP2103, HIP2104 is rated for -10V without any time constraints, this negative voltage component is of no consequence. In the unlikely event that the negative transient exceeds -10V, there are several ways of reducing the negative amplitude of this transient if necessary. If the bridge FETs are turned off more slowly to reduce di/dt, the amplitude will be reduced but at the expense of more switching losses in the FETs. Careful PCB design will also reduce the value of the parasitic inductance. However, in extreme cases, these two solutions by themselves may not be sufficient. Figure 25 illustrates a simple method for clamping the negative transient. Two series connected, fast 1 amp PN junction diodes are connected between HS and VSS as shown. It is important that these diodes be placed as close as possible to the HS and VSS pins to minimize the parasitic inductance of this current path between the two pins. Two diodes in series are required because they are in parallel with the body diode of the low side FET. If only one diode is used for the clamp, it will conduct some of the negative load current that is flowing in the body diode of the low side FET. An alternative to the two series connected diodes is one diode and a resistor (Figure 26). In this case, it is necessary to limit the current in the diode with a small value resistor, RHS, connected between the phase node of the 1/2 bridge and the HS pin. Observe that RHS is effectively in series with the HO output and serves as a peak current limiting gate resistor on HO. The value of RHS is determined by how much average current in the clamping diode is acceptable. Current in the low side FET flows through the body diode during the dead time resulting with a negative voltage on HS that is typically about -1.5V. When the low-side FET is turned on, the current through the body diode is shunted away into the channel and the conduction voltage from source to drain is typically much less than the conduction voltage through the body diode. Consequently, significant current will flow in the clamping diode only during the dead time. Because the dead time is much less than the on time of the low side FET, the resulting average current in the clamping diode is very low. The value of RHS is then chosen to limit the peak current in the clamping diode and usually just a few ohms is necessary. The methods to clamp the negative transients with diodes can still result with high frequency oscillations on the HS node depending on the parasitics of the PCB design. An alternative to the clamping diode in Figure 26 is a small value capacitor instead of the diode. This capacitor and RHS is very effective for minimizing the negative spike amplitude and oscillations. FIGURE 24. PARASITIC INDUCTANCE ON HS NODE VSS HS LO HO Inductive Load + - + - HB CBOOT FIGURE 25. TWO CLAMPING DIODES TO SUPPRESS NEGATIVE TRANSIENTS FIGURE 26. RESISTOR AND DIODE NEGATIVE TRANSIENT CLAMP VSS HS LO HO Inductive Load HB CBOOT 1V - + VSS HS LO HO Inductive Load + - + - RHS HB CBOOT |
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