IMX7SCEC datasheet(21/152 Pages) NXP

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Electrical characteristics

i.MX 7Solo Family of Applications Processors Datasheet, Rev. 5, 07/2017

NXP Semiconductors

4.1.2

Thermal resistance

4.1.2.1

FPBGA case “X” and case “Y” package thermal resistance

Table 8 displays the thermal resistance data.

4.1.3

Operating ranges

Table 9 provides the operating ranges of the i.MX 7Solo family of processors. For details on the chip's

power structure, see the “Power Management Unit (PMU)” chapter of the i.MX 7Solo Application

Processor Reference Manual (IMX7SRM).

1 OVDD is the I/O supply voltage.

Table 8. Thermal Resistance Data

Rating

Test conditions

Symbol

12x12

pkg value

19x19

pkg value

Unit

Junction to Ambient1

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Single-layer board (1s); natural convection2

Four-layer board (2s2p); natural convection2

2 Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified

package.

RθJA

55.4

32.6

44.4

30.2

oC/W

Junction to Ambient1

Single-layer board (1s); airflow 200 ft/min2,3

Four-layer board (2s2p); airflow 200 ft/min2,3

3 Per JEDEC JESD51-6 with the board horizontal.

RθJA

41.8

28.0

34.3

25.8

oC/W

Junction to Board1,4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—RθJB

16.0

17.4

oC/W

Junction to Case1,5

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

—RθJC

10.5

10.4

oC/W

Junction to Package Top1,6

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Natural Convection

ΨJT

0.2

oC/W

Junction to Package Bottom

Natural Convection

RθB_CSB

15.3

17.3

oC/W

Table 9. Operating ranges

Parameter

Description

Symbol

Min

Typ

Max1

Unit

Comment

Run Mode

VDD_ARM

0.95

1.0

1.155

Operation at 800 MHz and

below

VDD_SOC

0.95

1.0

1.25

—

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