ADA4312-1

Data Sheet

Rev. A | Page 12 of 12

OUTLINE DIMENSIONS

2.70

2.60 SQ

2.50

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

1

0.65

BSC

16

5

8

9

12

13

4

4.10

4.00 SQ

3.90

0.45

0.40

0.35

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

BOTTOM VIEW

SEATING

PLANE

TOP VIEW

SIDE VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

1

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

EXPOSED

PAD

Figure 21. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-16-17)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADA4312-1ACPZ-R2

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-17

ADA4312-1ACPZ-R7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-17

ADA4312-1ACPZ-RL

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP]

CP-16-17

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D11044-0-4/17(A)