Data Sheet

ADA4310-1

Rev. C | Page 5 of 14

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

10-Lead MINI_SO_EP

12 V

16-Lead LFCSP

±6V

Power Dissipation

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

specified for device soldered in circuit board for surface-mount

packages.

Table 3.

Package Type

Unit

10-Lead MINI_SO_EP

44

°C/W

16-Lead LFCSP

63

°C/W

Maximum Power Dissipation

The maximum safe power dissipation for the ADA4310-1 is

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the amplifiers. Exceeding a junction temperature of

150°C for an extended period can result in changes in silicon

devices, potentially causing degradation or loss of functionality.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 10-lead MINI_SO_EP

(44°C/W) and for the 16-lead LFCSP (63°C/W) on a JEDEC

AMBIENT TEMPERATURE (°C)

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

–35

–15

5

25

45

65

85

LFCSP_VQ-16

MINI_SO_EP-10

Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION