AD8336ACPZ-R7 datasheet(24/27 Pages) AD

24 / 27 page

AD8336

Data Sheet

Rev. F | Page 24 of 27

EVALUATION BOARD

An evaluation board, AD8336-EVALZ, is available online for

the AD8336. Figure 82 is a photo of the board.

The board is shipped from the factory configured for a non-

inverting preamplifier gain of 4×. To change the value of the

gain of the preamplifier or to change the gain polarity to inverting,

alter the component values or install components in the alternate

locations provided. All components are standard 0603 size, and

the board is compliant with RoHS requirements. Table 6 shows

the components to be removed and added to change the amplifier

configuration to inverting gain.

Table 6. Component Changes for Inverting Configuration

Remove

Install

R4, R7

R5, R6

OPTIONAL CIRCUITRY

The AD8336 features differential inputs for the gain control,

permitting nonzero or floating gain control inputs. To avoid any

delay in making the board operational, the gain input circuit is

shipped with Pin GNEG connected to ground via a 0 Ω resistor

in the R17 location. The user can adjust the gain of the device

by driving the GPOS test loop with a power supply or voltage

reference. Optional resistor networks R15/R17 and R13/R14

provide fixed-gain bias voltages at Pin GNEG and Pin GPOS for

non-zero common-mode voltages. The gain control can also be

driven with an active input such as a ramp. Provision is made for

an optional SMA connector at PRVG for monitoring the

preamplifier output or for driving the VGA from an external

source. Remove the 0 Ω resistor at R9 to isolate the preamplifier

from an external generator. The capacitor at Location C1 limits

the bandwidth of the preamplifier.

BOARD LAYOUT CONSIDERATIONS

The evaluation board uses four layers, with power and ground

planes located between two conductor layers. This arrangement

is highly recommended for customers, and several views of the

board are provided as reference for board layout details. When

laying out a printed circuit board for the AD8336, remember to

provide a pad beneath the device to solder the exposed pad of

the matching device. The pad in the board must have at least

five vias to provide a thermal path for the chip scale package.

Unlike leaded devices, the thermal pad is the primary means

to remove heat dissipated within the device.

Figure 82. AD8336 Evaluation Board

Figure 83. Component Side Copper

Figure 84. Secondary Side Copper

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