If MilitaryAerospace specified devices are required

please contact the National Semiconductor Sales

OfficeDistributors for availability and specifications

Storage Temperature

b

Ambient Temperature under Bias

b

Junction Temperature under Bias

Ceramic

b

Plastic

b

Ground Pin

b

Input Voltage (Note 2)

b

Input Current (Note 2)

b

Voltage Applied to Any Output

in the Disabled or

Power-Off State

b

in the HIGH State

b

Current Applied to Output

in LOW State (Max)

DC Latchup Source Current

Commercial

b

500 mA

Military

b

300 mA

Over Voltage Latchup (IO)

10V

ESD (HBM) Min

2000V

Note 1

Absolute maximum ratings are values beyond which the device may

be damaged or have its useful life impaired Functional operation under

these conditions is not implied

Note 2

Either voltage limit or current limit is sufficient to protect inputs

Recommended Operating

Conditions

Free Air Ambient Temperature

Military

b

Commercial

b

Supply Voltage

Military

a

Commercial

a

Minimum Input Edge Rate

(DV Dt)

Data Input

50 mVns

Enable Input

20 mVns

DC Electrical Characteristics

Symbol

Parameter

Min

Typ

Max

Units

Conditions

Input HIGH Voltage

20

V

Recognized HIGH Signal

Input LOW Voltage

08

V

Recognized LOW Signal

Input Clamp Diode Voltage

Min

b

12

V

Output HIGH Voltage

Min

25

V

Mil

Min

20

V

Comm

Min

20

V

Output LOW Voltage

Mil

Min

08

V

Comm

Min

08

V

Input HIGH Current

All Others

Max

5

m

Max

5

m

TMS TDI

Max

5

m

Input HIGH Current

Max

7

m

A

Breakdown Test

Input HIGH Current

Max

100

m

A

Breakdown Test (IO)

Input LOW Current

All Others

Max

b

5

m

Max

b

5

m

TMS TDI

Max

b

385

m

Input Leakage Test

00

475

V

All Other Pins Grounded

Output Leakage Current

Max

50

m

Output Leakage Current

Max

b

50

m

Output Leakage Current

Max

50

m

Output Leakage Current

Max

b

50

m

Note 1

Guaranteed not tested

http

www nationalcom

12