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STV9212

Soldering Information

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Soldering Information

The device can be soldered by wave, dipping or manually. Wave soldering is the preferred method

for mounting through-hole mount IC packages on a printed-circuit board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260

°C; solder at this temperature must not

be in contact with the joints for more than 5 seconds.The total contact time of successive solder

waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the

temperature of the plastic body must not exceed the specified maximum storage temperature

immediately after soldering to keep the temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane

or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300

°C it may

remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400

°C, contact

may last up to 5 seconds.